- Select One
- End-of-line wafer acceptance - Transistors (Vt), diodes, capacitors, resistors, gate delay
- Equipment qualification - Defect density
- Gate/poly - MOSCAP GOI, ECD, Vt
- Metal-2 - Contact check, electromigration, EWR
- New Technologies - RF/DC, SOC, FeRAMs, MRAMS, LCD-TEGs
- End-of-line wafer acceptance - Transistors (Vt), diodes, capacitors, resistors, gate delay
- Products
- Model 4200-SCS Semiconductor Characterization System - Leading-Edge Pulse Capability Integrated with Precision DC Measurement for the 65nm Node and Beyond
- Equipment qualification - Defect density
- Products
- Model 4200-SCS Semiconductor Characterization System - Leading-Edge Pulse Capability Integrated with Precision DC Measurement for the 65nm Node and Beyond
- S400DC/RF Single-insertion RF and DC Test Solution
- Gate/poly - MOSCAP GOI, ECD, Vt
- Products
- Model 2400 General-Purpose SourceMeter w/ Measurements up to 200V and 1A, 20W Power Output
- Model 4200-SCS Semiconductor Characterization System - Leading-Edge Pulse Capability Integrated with Precision DC Measurement for the 65nm Node and Beyond
- S600 Series Parametric Test Systems
- Metal-2 - Contact check, electromigration, EWR
- Products
- Model 4200-SCS Semiconductor Characterization System - Leading-Edge Pulse Capability Integrated with Precision DC Measurement for the 65nm Node and Beyond
- New Technologies - RF/DC, SOC, FeRAMs, MRAMS, LCD-TEGs
- Products
- Model 4200-SCS Semiconductor Characterization System - Leading-Edge Pulse Capability Integrated with Precision DC Measurement for the 65nm Node and Beyond
- S600 Series Parametric Test Systems
- S400DC/RF Single-insertion RF and DC Test Solution